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 Spin Etchers, LSE-200 (8 inch wafer)

                       LSE-300(12 inch wafer)

 

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Specification

     
   

Single wafer process, 6~12inch

Manual loading and unloading system

Acid-resistant materials and structure

Chemical recycle

Non contact wafer chuck

Etch uniformity:   + - 3%

2 chemicals, DIW rinse and N2 dry

Temperature control for chemicals

Chemical flow control

Spray swing arm movement

 

         

                     LSE-200

    1500Wx1000Dx1900H mm (LSE-200)

 

 

   

 

 

 

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