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Spin Etchers, JS2E-200 (½À½Ä ½ºÇÉ¿¡Ã³)

 

       Æ÷Å丮¼Ò±×·¡ÇÇÀÇ ÇÑ °øÁ¤ÀÎ ·¹Áö½ºÆ®ÀÇ ¿¡Äª(wet ching) ÀÛ¾÷¿ëÀ̸ç,  ¿þÀÌÆÛ ¹× ±Û·¡½º¸¦ ¿¡Äª, ¼¼Á¤ ¹× °ÇÁ¶ÇÕ´Ï´Ù.      ¿¡Äª¾× ¶Ç´Â ¾àÇ°ÀÇ ºÐ»ç ½Ã°£À» ÀÔ·ÂÇÏ¿© ¿øÇÏ´Â °á°ú¸¦ ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

      »ç¿ëÇϱâ Æí¸®ÇÏ°í, ¼ÒÇüÀ̸ç, °ß°íÇÕ´Ï´Ù.½º½º

  • ¿þÀÌÆÛ loading ¹× unloading:  manual
  • ¾Ð·Â¿ë±â ¹× regurator Á¦°ø
  • Substrate Sizes: Max. 12" diameterÄÚÅÍ ¸ðµ¨ JS401Àº À缺¿£Áö´Ï¾î¸µÀÇ ±âº»ÀÌ µÇ´Â ¿Ü»ê

 

 

Reliability

  • All PVC, PE, PTFE construction
  • Drain a port located in the bottom of the bowl
  • D.I rinse and N2 dry
  • 1 ³â°£ Ç°Áú º¸Áõ ( ºÎÇ° ¹× ÀηÂ)
  • °í°´¿¡ ´ëÇÑ ¹«Á¦ÇÑ application Á¦°ø

 

ÇÁ·Î±×·¥ ¹× Hardware

  • LCD touch screen
  • Wafer Size:     12" or less
  • Chamber Material:     PVC
  • 20 process programs
  • 10 steps per program (nozzle location settable)
  • Moving chenical nozzle spraying evenly
  • Spin Motor:     AC servo Motor
  • Spin Rotation:     Max. 1500 RPM
  • Rotation Controller:     PLC
  • Power Supply:     AC220V
  • N2 source:     0.2MPa , 50L/min, Ø6 connection
  • D.I water rinsing source:     0.2MPa, 10L/min, PT 1/2 connection
  • Drainage:     1 lines, PVC-25A
  • Body Size/ Material: 1000Wx600DX440H mm/PVC

 

 

 

 

 

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